Amaoe LCD 3 Stencil

Rs.238.00

  • Material: Japanese steel sheet
  • Sternness: Super hard
  • Hole  type: Square
  • Re-usable: Yes
  • Thickness: 0.12MM

Amaoe LCD 3 Stencil

The Amaoe LCD-3 Stencil is a professional BGA reballing stencil designed for iPhone screen IC and motherboard repair. This high-precision stencil supports a wide range of iPhone models and is ideal for repairing display IC, Face ID, infrared sensor, tailboard IC, and True Tone related components.

Manufactured from high-quality stainless steel, the stencil delivers exceptional durability, heat resistance, and long-term usability. The laser-cut aperture layout ensures accurate alignment of solder balls and consistent solder paste distribution, helping technicians perform precise micro-soldering tasks with minimal error.

With its ultra-thin 0.12mm design, the stencil fits perfectly on IC chips, ensuring stable placement during reballing operations. This reduces solder bridging and improves the success rate of delicate chip-level repairs.

The Amaoe LCD-3 stencil is widely used by professional mobile repair engineers and technicians for restoring screen functionality and advanced motherboard repairs in modern iPhones.


Key Features

  • Professional BGA reballing stencil for iPhone display IC repair
  • Compatible with iPhone 6S to iPhone 14 series
  • Supports Screen IC, Face ID, infrared, tailboard, and True Tone repairs
  • Precision laser-cut holes for accurate solder ball placement
  • Made from high-quality stainless steel for durability
  • 0.12mm ultra-thin design for precise chip alignment
  • Heat-resistant and reusable for multiple repairs
  • Reduces solder bridging and improves repair success rate
  • Ideal for micro-soldering and chip-level motherboard repair
  • Suitable for professional mobile repair technicians and service centers

Technical Specifications

  • Product Name: Amaoe LCD-3 Stencil
  • Brand: Amaoe
  • Model: LCD-3
  • Material: Premium Stainless Steel
  • Thickness: Approx. 0.12mm
  • Hole Type: Precision Laser-Cut Square / Micro Apertures
  • Stencil Type: BGA Reballing Stencil
  • Compatibility: iPhone 6S – iPhone 14 Series
  • Application: Screen IC / Face ID / Infrared / Tailboard IC Reballing
  • Usage: Smartphone Motherboard & Display IC Repair
  • Reusability: Yes (Professional Use)

 

 

Weight 0.010 kg