Amaoe M17P-012 Stencil

Amaoe M17P-012 Reballing Stencil for Smartphone Motherboard Chip Repair

The Amaoe M17P-012 Stencil is a high-precision BGA reballing stencil designed for smartphone motherboard chip repair and advanced micro-soldering applications. This professional repair tool allows technicians to accurately rebuild solder balls on IC chips, helping restore stable electrical connections and improve overall device performance after repair.

Manufactured using premium stainless steel with precision laser-cut technology, the stencil provides perfectly aligned holes for accurate solder ball placement during the reballing process. Its ultra-thin design ensures excellent heat transfer while soldering, enabling technicians to achieve clean, consistent, and reliable reballing results with minimal solder bridging.

The Amaoe M17P-012 stencil is engineered for professional chip-level motherboard repair, making it ideal for technicians working on smartphone PCB maintenance, IC chip replacement, and advanced BGA reballing tasks. The durable stainless steel construction allows repeated use while maintaining high precision, making it a reliable tool for professional repair environments.

Perfect for GSM repair technicians, electronics engineers, and mobile repair laboratories, the Amaoe stencil provides the accuracy and efficiency required for modern high-density smartphone motherboard repairs.

Key Features

• Precision BGA reballing stencil for IC chip repair
• Designed for smartphone motherboard chip-level maintenance
• Made from high-quality stainless steel for durability
• Precision laser-cut holes for accurate solder ball placement
• Ultra-thin design improves heat transfer during soldering
• Ensures stable chip alignment and reliable connections
• Helps minimize solder bridging and repair errors
• Ideal for micro-soldering and advanced PCB repair
• Reusable professional repair stencil
• Suitable for mobile repair technicians and GSM service centers

Technical Specifications