Amaoe Magic V Flip Stencil

Amaoe MGVF-012 Magic V Flip BGA Reballing Stencil for Foldable Smartphone Repair

The Amaoe MGVF-012 Magic V Flip Stencil is a precision-engineered BGA reballing stencil specially designed for Magic V Flip foldable smartphone motherboard repair. Built for advanced technicians, this stencil ensures accurate solder ball placement for delicate and high-density IC components found in modern foldable devices.

Crafted from premium-grade stainless steel using high-precision laser cutting, the stencil features perfectly aligned apertures that match the motherboard layout. The 0.12mm thickness ensures controlled solder flow, delivering clean, consistent, and reliable reballing results without bridging or misalignment.

Designed for chip-level repair, micro-soldering, and PCB restoration, the Amaoe Magic V Flip stencil is ideal for professional GSM technicians working on next-generation foldable smartphones. Its durable and reusable design ensures long-term performance, making it a valuable tool in any repair lab.

Whether you’re repairing hinge-area boards or compact IC sections, this stencil provides the precision and stability needed for high-quality repairs.

Key Features

• Specially designed for Magic V Flip motherboard repair
• 0.12mm precision thickness for accurate solder control
• High-precision laser-cut design for perfect alignment
• Made from durable stainless steel material
• Ensures uniform solder ball placement
• Ideal for foldable smartphone chip-level repair
• Reduces short circuit and solder bridging risks
• Suitable for BGA reballing and PCB repair tasks
• Reusable and long-lasting professional tool
• Enhances repair accuracy and efficiency

Technical Specifications