Amaoe MI-19 Stencil

Rs.238.00

The Amaoe MI-19 Stencil is a precision stainless steel BGA reballing stencil designed for Xiaomi smartphone CPU and IC chip repair with accurate solder ball alignment.

Amaoe MI-19 Stencil for Xiaomi Motherboard BGA Reballing

The Amaoe MI-19 Stencil is a professional-grade BGA reballing stencil specially designed for repairing Xiaomi smartphone motherboards. It allows technicians to perform precise CPU, RAM, and IC chip reballing, ensuring reliable solder connections and restoring device functionality during chip-level repair.

Crafted from high-quality stainless steel, the Amaoe MI-19 stencil provides excellent durability, high heat resistance, and long-term usability. Its ultra-precise laser-cut holes ensure accurate solder ball placement, making the reballing process smoother and more efficient.

The stencil features an ultra-thin design that aligns perfectly with IC chips, allowing technicians to complete micro-soldering tasks with greater precision and stability. It is widely used by professional mobile repair technicians and advanced motherboard repair labs for Xiaomi device maintenance.

Whether you are performing CPU reballing, IC replacement, or motherboard restoration, the Amaoe MI-19 stencil is an essential repair tool that improves work efficiency and ensures professional repair results.


Key Features

  • Designed for Xiaomi smartphone motherboard repair
  • High precision BGA reballing stencil
  • Durable stainless steel construction
  • Laser-cut micro holes for accurate solder ball placement
  • Ultra-thin design for precise chip alignment
  • High temperature resistant for soldering operations
  • Helps achieve stable and clean reballing results
  • Ideal for CPU, RAM, and IC chip repair
  • Reusable and long-lasting repair tool
  • Suitable for professional mobile repair technicians

Technical Specifications

  • Product Name: Amaoe MI-19 Stencil
  • Brand: Amaoe
  • Material: Stainless Steel
  • Type: BGA Reballing Stencil
  • Manufacturing Process: Precision Laser Cutting
  • Compatibility: Xiaomi smartphone motherboard chips
  • Design: Ultra-thin precision stencil
  • Heat Resistance: High temperature resistant
  • Application: CPU / RAM / IC chip reballing
  • Usage: Mobile motherboard micro soldering repair

 

Weight 0.020 kg
Dimensions 15 × 12 × 10 cm