AMAOE MI-4 Stencil for Redmi Note 2 Note 3

Rs.238.00

AMAOE MI-4 Stencil is a high-precision stainless steel BGA reballing stencil designed for Redmi Note 2 and Note 3 motherboard chip repair.

AMAOE MI-4 Stencil for Redmi Note 2 / Note 3 – Professional BGA Reballing Tool

The AMAOE MI-4 Stencil for Redmi Note 2 Note 3 is a precision-engineered BGA reballing stencil crafted for professional mobile repair technicians. Designed specifically for Xiaomi Redmi Note 2 and Note 3 devices, this stencil ensures accurate solder ball alignment during CPU, eMMC, and IC rework.

Made with premium-grade stainless steel and precision laser-cut technology, the MI-4 stencil delivers exceptional durability and heat resistance, making it suitable for repeated workshop use. The uniform hole pattern guarantees precise solder placement, reducing bridging and improving repair success rates.

Ideal for motherboard rework, chip replacement, and advanced servicing tasks, the AMAOE MI-4 stencil helps technicians achieve clean and reliable reballing results with every repair.


Key Features:

  • Precision laser-cut stainless steel BGA stencil
  • Compatible with Redmi Note 2 & Note 3 motherboards
  • Accurate solder ball positioning for consistent results
  • Heat resistant and reusable design
  • Durable and long-lasting construction
  • Smooth surface for easy cleaning
  • Minimizes solder bridging and errors
  • Ideal for CPU, eMMC & IC reballing
  • Professional-grade repair tool

Technical Specifications:

  • Brand: AMAOE
  • Model: MI-4
  • Compatibility: Redmi Note 2, Redmi Note 3
  • Material: Premium stainless steel
  • Type: BGA Reballing Stencil
  • Manufacturing: Precision laser cutting
  • Application: CPU, eMMC & IC chip reballing
  • Usage: Mobile motherboard repair
Weight 0.010 kg
Dimensions 15 × 12 × 10 cm