AMAOE MI-6 Stencil for Redmi Note 5 / Note 5 Pro / Note 3 / Mi A2 – Professional BGA Reballing Tool
The AMAOE MI-6 Stencil for Redmi Note 5 Pro is specially engineered for professional mobile repair technicians performing advanced chip-level repairs. Designed for popular Xiaomi Redmi models including Note 5, Note 5 Pro, Note 3, and Mi A2, this stencil ensures precise solder ball alignment during CPU, eMMC, and IC reballing.
Manufactured from premium-grade stainless steel, the MI-6 stencil offers excellent heat resistance, durability, and reusability. Its laser-cut precision hole pattern guarantees uniform solder ball placement, reducing repair errors and improving success rates.
Ideal for motherboard servicing and BGA chip rework, the AMAOE MI-6 stencil enhances repair efficiency while delivering clean and consistent reballing results.
Key Features:
- High-precision laser-cut BGA stencil
- Compatible with Redmi Note 5, Note 5 Pro, Note 3 & Mi A2
- Durable stainless steel construction
- Accurate solder ball alignment
- Heat resistant and reusable design
- Smooth surface for easy cleaning
- Ideal for CPU, eMMC & IC reballing
- Professional tool for chip-level repair
Technical Specifications:
- Brand: AMAOE
- Model: MI-6
- Compatibility: Redmi Note 5, Note 5 Pro, Note 3, Mi A2
- Material: Premium stainless steel
- Type: BGA Reballing Stencil
- Technology: Precision laser-cut
- Application: CPU, eMMC & IC chip reballing
- Usage: Mobile motherboard repair













