AMAOE EMMC-3 Stencil

The AMAOE EMMC-3 Stencil is a high-precision BGA reballing stencil engineered for professional mobile and motherboard chip repairs. This versatile stencil is ideal for accurate solder paste or solder ball application on eMMC, EMCP, UFS, UMCP, LPDDR, NAND, and PCI BGA-type chips.

Crafted from durable, heat-resistant steel mesh with ultra-fine laser-cut openings, the AMAOE EMMC-3 Stencil ensures consistent alignment, improved solder distribution, and cleaner reballing results with minimal bridging. Its multi-compatible design supports various BGA chip sizes — making it a must-have tool for technicians and electronics repair professionals.

Whether you’re working on mobile phones, tablets, laptops, or other board-level repair jobs, this stencil enhances precision, reduces rework time, and delivers reliable results with every use.

Key Features:

• High-precision laser-cut openings for accurate BGA reballing
• Multi-compatible with eMMC, EMCP, UFS, UMCP, LPDDR, NAND, and PCI chips
• Durable, heat-resistant stainless steel construction
• Ensures uniform solder ball or paste alignment
• Reduces bridging and soldering errors
• Ideal for board-level repairs and advanced technician use
• Reusable and easy to clean after every use
• Compact and lightweight workshop tool
• Provides professional repair results
• Great value for technicians and DIY electronics repairers

Technical Specifications:

• Brand: AMAOE
• Model: EMMC-3
• Material: Stainless steel (high-precision laser cut mesh)
• Application: BGA reballing for eMMC, EMCP, UFS, UMCP, LPDDR, NAND, PCI chips
• Supported BGA Types: BGA162, BGA153, BGA169, BGA221, BGA186, BGA254, and more
• Thickness: Approx. 0.15 mm
• Reusable: Yes
• Weight: ~10-20 g (approx.)
• Finish: Anti-rust metallic surface
• Usage: Professional and workshop-level BGA repair