Amaoe MQ-1 Stencil for MTK / Qualcomm CPU

Amaoe MQ-1 Stencil for MTK / Qualcomm CPU – Precision BGA Reballing Tool

The Amaoe MQ-1 Stencil for MTK / Qualcomm CPU is a professional-grade BGA reballing stencil engineered for accurate and reliable CPU repair. Designed for mobile repair technicians, this stencil ensures perfect solder ball alignment during chip-level rework of MediaTek (MTK) and Qualcomm processors.

Manufactured from high-quality stainless steel, the MQ-1 stencil features ultra-precise laser-cut holes for clean and uniform solder ball formation. It minimizes solder bridging, improves joint strength, and enhances overall repair success rates.

Whether you are repairing dead motherboards, shorted CPUs, or performing chip replacement, the Amaoe MQ-1 stencil provides the accuracy and durability required for advanced smartphone motherboard repairs.

Key Features:

• Compatible with MTK and Qualcomm CPUs
• High-precision laser-cut BGA design
• Ensures accurate solder ball placement
• Premium stainless steel construction
• Heat-resistant and reusable material
• Reduces solder bridging and misalignment
• Supports advanced chip-level repair
• Provides stable and long-lasting solder joints
• Lightweight and easy to handle

Technical Specifications:

• Brand: Amaoe
• Model: MQ-1
• Compatibility: MTK (MediaTek) & Qualcomm CPU chipsets
• Material: High-grade stainless steel
• Application: CPU BGA reballing
• Cut Type: Precision laser-cut
• Heat Resistance: High temperature resistant
• Usage: Professional mobile repair technicians