Amaoe MT6879V Dimensity 1050 Stencil

Amaoe MT6879V Dimensity 1050 Stencil for CPU BGA Reballing

The Amaoe MT6879V Dimensity 1050 Stencil is a precision-engineered BGA reballing stencil specifically designed for repairing and reballing the MediaTek Dimensity 1050 (MT6879V) processor used in modern smartphones. Manufactured with high-quality stainless steel and advanced laser-cut technology, this stencil ensures accurate solder ball placement and reliable chip alignment during the reballing process.

Designed for professional mobile repair technicians, the stencil features an ultra-thin construction that allows efficient heat transfer during soldering, helping produce perfectly shaped solder balls while minimizing bridging or solder overflow. Its durable structure ensures long-term use without bending or deformation.

The Amaoe MT6879V stencil is an essential tool for CPU reballing, motherboard repair, and advanced micro-soldering work, making it ideal for GSM repair labs and technicians working with MediaTek chipset devices. With precise hole alignment and professional-grade quality, this stencil helps improve repair accuracy and efficiency.

Key Features

• Designed for MediaTek Dimensity 1050 (MT6879V) CPU reballing
• Precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel material
• Ultra-thin design for better heat transfer during soldering
• Ensures perfect chip alignment during the reballing process
• Reduces solder bridging and improves repair precision
• Durable and reusable professional stencil
• Suitable for mobile phone motherboard chip repair
• Lightweight and easy to handle during micro-soldering
• Trusted Amaoe quality for professional technicians

Technical Specifications