Amaoe MT8781 MT6789V Stencil

Amaoe MT8781 / MT6789V Stencil for MediaTek CPU BGA Reballing

The Amaoe MT8781 / MT6789V Stencil is a precision BGA reballing stencil designed specifically for repairing and reballing MediaTek MT8781 and MT6789V processors used in modern smartphones and tablets. Built with high-grade stainless steel and advanced laser-cut technology, this stencil provides extremely accurate solder ball positioning, ensuring professional chip-level repair results.

The stencil features an ultra-thin and heat-resistant structure that allows optimal heat distribution during the soldering process. This helps technicians achieve uniform solder ball formation and precise chip alignment, minimizing the chances of solder bridging or misplacement.

Designed for professional mobile repair technicians, the Amaoe MT8781 / MT6789V stencil is ideal for CPU reballing, motherboard repair, and micro-soldering work. Its durable construction allows repeated use without deformation, making it a reliable tool for GSM repair labs and advanced electronics repair workshops.

Whether you are restoring damaged CPU connections or performing chip replacement, this stencil helps deliver accurate and consistent reballing performance.

Key Features

• Designed for MediaTek MT8781 and MT6789V CPU reballing
• High-precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel for durability
• Ultra-thin design for efficient heat transfer during soldering
• Ensures perfect chip alignment during the reballing process
• Reduces solder bridging and improves repair accuracy
• Reusable professional repair stencil
• Suitable for smartphone and tablet motherboard repairs
• Lightweight and easy to handle for micro-soldering tasks
• Reliable Amaoe quality for professional technicians

Technical Specifications