Amaoe MZ-4 Stencil

The Amaoe MZ-4 Stencil is a professional-grade BGA reballing stencil designed for accurate IC chip repair and motherboard rework applications. Engineered with premium stainless steel and advanced laser-cut technology, this stencil delivers precise solder ball alignment and consistent solder paste distribution for reliable reballing results.

Built for professional technicians and advanced repair workshops, the MZ-4 stencil minimizes solder bridging, improves solder joint durability, and enhances overall repair efficiency. Its heat-resistant and anti-corrosion construction ensures long-term performance even under repeated hot air and reflow soldering conditions.

Whether you’re replacing BGA chips, servicing motherboard faults, or performing detailed IC rework, the Amaoe MZ-4 stencil provides clean, accurate, and professional-level results every time.

Key Features:

• Precision laser-cut stainless steel construction
• Designed for accurate BGA IC reballing
• Ensures uniform solder ball placement
• Reduces solder bridging and alignment errors
• High heat resistance for hot air and reflow systems
• Durable, anti-rust, and reusable design
• Improves solder joint strength and conductivity
• Lightweight and easy to position on PCB
• Suitable for advanced motherboard repair tasks
• Ideal for professional mobile repair technicians

Technical Specifications:

• Brand: Amaoe
• Model: MZ-4
• Material: Premium stainless steel
• Application: BGA IC reballing and motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Various BGA IC chip layouts (model-specific design)