AMAOE SM7750 Stencil

AMAOE 7Gen4 SM7750 BGA Reballing Stencil (14×14×0.7mm) for Precision IC Repair

The AMAOE 7Gen4 SM7750 Stencil (14×14×0.7mm) is a high-precision BGA reballing stencil specifically engineered for Qualcomm SM7750 chipset repair and advanced motherboard rework. Designed with cutting-edge etching technology, this stencil ensures accurate solder ball placement and consistent reballing results for professional technicians.

Made from premium-grade stainless steel, the stencil offers exceptional heat resistance, durability, and long-term performance. Its ultra-precise hole alignment allows uniform solder paste distribution, minimizing bridging and improving repair success rates.

With a compact 14×14mm size and 0.7mm thickness, the stencil provides excellent stability and ease of handling during intricate repair tasks. It is ideal for working on CPU, GPU, and high-density IC components in smartphones and advanced electronic devices.

Whether you’re performing chip-level repairs or professional servicing, the AMAOE SM7750 Stencil delivers precision, efficiency, and reliability for demanding reballing applications.

Key Features

• Designed for SM7750 chipset reballing
• High-precision laser-etched stencil holes
• Made from durable stainless steel material
• Ensures accurate solder ball placement
• Heat-resistant and deformation-resistant
• Compact 14×14mm size for precise work
• 0.7mm thickness for stability and durability
• Ideal for CPU, GPU, and IC repair
• Reduces soldering errors and improves efficiency
• Suitable for professional technicians

Technical Specifications