AMAOE 14 Ultra Mini Board Stencil

AMAOE 14 Ultra Mini Board BGA Reballing Stencil for Precision IC Repair

The AMAOE 14 Ultra Mini Board Stencil is a high-precision BGA reballing stencil designed for mini motherboard repair and advanced IC rework. Specifically engineered for compact board layouts, this stencil ensures accurate solder ball placement and efficient reballing performance for professional technicians.

Manufactured from premium stainless steel, the stencil offers excellent heat resistance, durability, and deformation stability, even under high-temperature soldering conditions. Its finely etched mesh structure enables uniform solder paste application, minimizing errors and improving repair success rates.

Designed for ultra-mini board configurations, this stencil is ideal for working on high-density chipsets, CPU, GPU, and power ICs in modern smartphones. Its compact design allows precise alignment and easy handling during intricate repair processes.

Whether you’re performing chip-level repairs or working on compact motherboard circuits, the AMAOE 14 Ultra Mini Board Stencil delivers precision, reliability, and professional-grade results.

Key Features

• Designed for ultra mini board IC reballing
• High-precision laser-etched stencil holes
• Made from durable stainless steel material
• Accurate alignment for perfect solder ball placement
• Heat-resistant and deformation-resistant design
• Ideal for CPU, GPU, and power IC repair
• Suitable for high-density chipsets
• Compact design for precision work
• Improves repair accuracy and efficiency
• Professional-grade quality

Technical Specifications