AMAOE M15SP-012 BGA Reballing Stencil

AMAOE M15SP-012 BGA Reballing Stencil for 15S Pro (Precision IC Repair Tool)

The AMAOE M15SP-012 Stencil for 15S Pro is a precision-engineered BGA reballing stencil designed specifically for 15S Pro motherboard and chipset repair. Built for professional technicians, this stencil ensures accurate solder ball alignment and reliable reballing results for advanced mobile repair work.

Manufactured from high-quality stainless steel, the stencil offers excellent heat resistance, durability, and resistance to deformation during high-temperature soldering processes. Its laser-etched precision holes allow for uniform solder paste distribution, reducing bridging and enhancing repair success rates.

The M15SP-012 stencil is optimized for chip-level repair, making it ideal for reworking CPU, GPU, and power ICs on 15S Pro devices. Its design ensures easy alignment and stable handling, allowing technicians to work with maximum accuracy and efficiency.

Whether you are performing professional servicing or advanced reballing tasks, the AMAOE 15S Pro Stencil delivers precision, consistency, and high-quality performance.

Key Features

• Designed for 15S Pro chipset reballing
• High-precision laser-etched stencil holes
• Made from durable stainless steel material
• Accurate solder ball placement for reliable results
• Heat-resistant and deformation-resistant design
• Ensures uniform solder paste application
• Ideal for CPU, GPU, and IC repair
• Easy alignment and stable positioning
• Reduces reballing errors and improves efficiency
• Suitable for professional technicians

Technical Specifications