Amaoe SU-3 Stencil for Spreadtrum CPU
Rs.238.00
Professional Amaoe SU-3 stencil designed for precise Spreadtrum CPU BGA reballing and advanced motherboard repair.
Amaoe SU-3 Stencil for Spreadtrum CPU
The Amaoe SU-3 Stencil for Spreadtrum CPU is a high-precision BGA reballing stencil engineered specifically for Spreadtrum processor chip repair. Designed to deliver accurate solder ball placement and perfect alignment, this stencil ensures reliable CPU reinstallation during advanced motherboard rework.
Manufactured from premium-quality stainless steel using advanced laser-cut technology, the SU-3 stencil offers excellent durability, high heat resistance, and long-term usability. It minimizes solder bridging, improves solder joint strength, and increases overall repair efficiency in chip-level servicing.
Ideal for professional mobile repair technicians and service centers, the Amaoe SU-3 stencil enhances workflow accuracy and provides consistent results in complex CPU reballing operations.
Key Features:
- Specially designed for Spreadtrum CPU reballing
- High-precision laser-cut BGA template
- Premium stainless steel construction
- Ensures uniform solder ball distribution
- Reduces solder bridging and short circuit risks
- High heat resistance for hot air & reflow stations
- Durable, anti-rust, and reusable design
- Improves solder joint strength and conductivity
- Lightweight and easy PCB positioning
- Suitable for professional motherboard repair labs
Technical Specifications:
- Brand: Amaoe
- Model: SU-3
- Material: High-grade stainless steel
- Application: Spreadtrum CPU BGA reballing
- Thickness: Approx. 0.12 mm – 0.15 mm
- Precision Tolerance: ±0.01 mm
- Heat Compatibility: Suitable for hot air & reflow soldering
- Reusable: Yes
- Surface Finish: Anti-corrosion coating
- Weight: Approx. 10–20 g
| Weight | 0.020 kg |
|---|---|
| Dimensions | 15 × 12 × 10 cm |
