Amaoe U-APU3 Stencil

The Amaoe U-APU3 Stencil is a professional BGA reballing stencil designed for precise APU/CPU IC reballing and advanced motherboard repair work. It is widely used by mobile repair technicians for performing accurate chip-level repairs on smartphone motherboards.

Manufactured from high-quality stainless steel with precision laser-cut technology, the Amaoe U-APU3 stencil ensures perfect solder ball alignment and stable IC positioning during the reballing process. The ultra-thin and durable design allows technicians to apply solder paste smoothly while maintaining high precision even during high-temperature soldering.

This stencil is ideal for professional mobile repair workshops and service centers, helping reduce solder bridging, improve repair efficiency, and ensure reliable CPU/APU chip restoration.

Key Features

• Designed for APU / CPU BGA IC reballing
• High-precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel for durability and long life
• Ultra-thin structure for perfect chip alignment
• High temperature resistance for professional soldering work
• Helps prevent solder bridging and alignment errors
• Suitable for mobile motherboard IC repair and rework
• Ideal for professional GSM technicians and repair labs

Technical Specifications