AMAOE U-APU6 Stencil

The AMAOE U-APU6 Stencil is a professional-grade BGA reballing stencil designed for precise CPU and IC chip repair in modern smartphones and electronic motherboards. Crafted from high-quality stainless steel with ultra-precise laser-cut holes, this stencil ensures accurate solder ball placement and consistent reballing results.

Perfect for professional technicians and mobile repair laboratories, the AMAOE U-APU6 stencil provides excellent heat resistance and long-term durability during repeated soldering processes. Its ultra-thin structure allows perfect alignment with chip pads, helping technicians perform faster and more reliable CPU reballing repairs.

Whether you are repairing complex smartphone motherboards or replacing damaged IC chips, the AMAOE U-APU6 stencil is an essential tool for achieving professional-quality repair results.

Key Features

• Precision laser-cut holes for accurate BGA reballing
• Made from premium stainless steel for durability
• Ultra-thin stencil design for perfect chip alignment
• High temperature resistance for soldering work
• Ideal for CPU and IC chip reballing
• Reusable professional repair tool
• Lightweight and compact for easy handling
• Suitable for advanced motherboard repair tasks

Technical Specifications

• Product Name: AMAOE U-APU6 Stencil
• Brand: Amaoe
• Material: High-quality Stainless Steel
• Type: BGA Reballing Stencil
• Manufacturing: Precision Laser Cut
• Compatibility: CPU / IC Chips
• Application: Smartphone Motherboard Repair
• Heat Resistance: High Temperature Resistant
• Reusable: Yes