Amaoe U-APU5 Stencil

The Amaoe U-APU5 Stencil is a high-precision BGA reballing stencil specially designed for professional mobile repair technicians working on advanced CPU and power IC chips. Manufactured with premium stainless steel and laser-cut precision holes, this stencil ensures accurate solder ball placement and reliable chip reballing performance.

Ideal for motherboard repair labs and mobile technicians, the Amaoe U-APU5 stencil provides excellent heat resistance and long-lasting durability during repeated soldering operations. Its ultra-thin design allows perfect alignment with chip pads, making the reballing process faster, cleaner, and more efficient.

Whether you are repairing smartphones, tablets, or other electronic devices, this stencil helps achieve professional-grade results and improves overall repair efficiency.

Key Features

• High precision laser-cut stencil holes for accurate BGA reballing
• Made from premium stainless steel for durability
• Ultra-thin design for perfect chip alignment
• High temperature resistance during soldering
• Ideal for CPU / IC reballing and motherboard repair
• Reusable and long-lasting for professional repair work
• Compact and lightweight design for easy handling

Technical Specifications

• Product Name: Amaoe U-APU5 Stencil
• Material: High-quality Stainless Steel
• Stencil Type: BGA Reballing Stencil
• Design: Ultra-thin precision laser cut
• Compatibility: Mobile CPU / IC chip reballing
• Usage: Smartphone motherboard repair
• Heat Resistance: High temperature soldering support
• Reusable: Yes