Amaoe U-MTK7 Stencil

The Amaoe U-MTK7 Stencil is a professional BGA reballing stencil specially designed for accurate solder ball placement on MediaTek (MTK) CPU and RAM chipsets used in modern smartphones. This high-precision stencil enables technicians to perform reliable motherboard chip repairs and restore damaged processors with ease.

Crafted from premium stainless steel with precision laser cutting, the stencil ensures perfect hole alignment for consistent solder ball distribution. Its ultra-thin design allows stable positioning over the chipset, making the reballing process faster and more efficient.

The Amaoe U-MTK7 stencil is widely used in mobile phone repair labs, GSM service centers, and micro-soldering workshops where precision and durability are essential. It helps reduce solder bridging, improve chip rework accuracy, and enhance overall repair success rates.

Key Features

• Designed for MTK Chipsets – Ideal for MediaTek CPU and RAM reballing.
• High Precision Laser-Cut Holes – Ensures accurate solder ball placement.
• Premium Stainless Steel Material – Durable and heat resistant.
• Ultra-Thin Professional Design – Perfect alignment for chip reballing.
• Anti-Deformation Structure – Maintains shape even after repeated heating.
• Improves Reballing Accuracy – Reduces solder bridging and chip damage.
• Reusable Professional Tool – Long service life for repair workshops.
• Smooth Surface Finish – Easy to clean after soldering operations.
• Compatible with Multiple MTK Chips – Supports various MediaTek processors.
• Essential GSM Repair Tool – Suitable for advanced motherboard repairs.

Technical Specifications

• Product Name: Amaoe U-MTK7 Reballing Stencil
• Model: U-MTK7
• Brand: Amaoe
• Material: High-quality Stainless Steel
• Manufacturing Technology: Precision Laser Cutting
• Application: BGA CPU & RAM Reballing
• Chip Compatibility: MediaTek (MTK) Processors
• Thickness: Ultra-thin professional grade
• Usage: Smartphone motherboard chip repr
• Category: Mobile Phone Repair Tool