Amaoe U-MTK6 Stencil

The Amaoe U-MTK6 Stencil is a high-precision BGA reballing stencil designed for professional mobile technicians working with MediaTek (MTK) CPU and RAM chipsets. This stencil allows accurate solder ball placement during motherboard chip repairs, ensuring stable and long-lasting connections after rework.

Manufactured using premium stainless steel and advanced laser-cut technology, the stencil provides perfectly aligned holes for consistent solder ball distribution. Its ultra-thin and durable design ensures proper chip alignment and improves efficiency during the reballing process.

The Amaoe U-MTK6 stencil is widely used in GSM repair laboratories, mobile service centers, and micro-soldering workshops where precision and reliability are critical. It helps technicians perform clean, accurate, and professional reballing for MTK processors while reducing solder bridging and chip damage.

Key Features

• Designed for MediaTek (MTK) CPU and RAM chip reballing
• Precision laser-cut hole design for accurate solder placement
• Made from high-quality stainless steel for durability
• Ultra-thin professional stencil design for easy chip alignment
• High temperature resistant during soldering process
• Helps reduce solder bridging and misalignment
• Ensures stable and reliable chip rework results
• Reusable and long-lasting repair tool
• Suitable for advanced smartphone motherboard repair
• Ideal for GSM technicians and professional repair labs

Technical Specifications

• Product Name: Amaoe U-MTK6 Stencil
• Brand: Amaoe
• Model: U-MTK6
• Material: Premium Stainless Steel
• Manufacturing Process: Precision Laser Cutting
• Type: BGA Reballing Stencil
• Chip Compatibility: MediaTek (MTK) CPU & RAM
• Application: Smartphone Motherboard Repair
• Heat Resistance: High Temperature Resistant
• Usage: Professional GSM Repair Tool