Amaoe X-012 iPhone X Stencil

Amaoe X-012 Stencil for iPhone X Middle Layer Motherboard Reballing

The Amaoe X-012 Stencil for iPhone X is a professional BGA reballing stencil specifically designed for repairing the middle layer motherboard of the iPhone X. Built for advanced chip-level repair, this stencil helps technicians perform precise solder ball placement and accurate alignment during the motherboard reballing process.

Manufactured using high-quality stainless steel with precision laser-cut technology, the stencil ensures uniform hole positioning for consistent solder ball formation. Its ultra-thin design allows efficient heat transfer during soldering, helping technicians achieve smooth and reliable solder joints while reducing the risk of bridging or misalignment.

The Amaoe X-012 stencil is ideal for middle layer motherboard repair, CPU/IC chip reballing, and micro-soldering work on iPhone X devices. Its durable and reusable construction makes it an essential tool for professional mobile repair technicians and GSM repair labs.

With precise alignment and reliable performance, the Amaoe X-012 stencil helps technicians complete accurate and efficient motherboard restoration during complex iPhone repair procedures.

Key Features

• Designed for iPhone X middle layer motherboard reballing
• High-precision laser-cut holes for accurate solder ball placement
• Made from premium stainless steel for durability
• Ultra-thin structure for efficient heat transfer during soldering
• Ensures precise chip alignment during reballing
• Reduces solder bridging and improves repair accuracy
• Reusable professional repair stencil
• Ideal for CPU, IC, and motherboard chip repair
• Lightweight and easy to handle during micro-soldering
• Trusted Amaoe professional repair quality

Technical Specifications