IP13 Motherboard Repair Heating System SS-T12A-N13

Rs.3,250.00

The IP13 Motherboard Repair Heating System SS-T12A-N13 is a professional motherboard heating platform specifically designed for iPhone 13 series logic board repair, chip replacement, soldering, and PCB rework.

Out of stock

IP13 Motherboard Repair Heating System SS-T12A-N13

The IP13 Motherboard Repair Heating System SS-T12A-N13 is a specialized repair tool engineered for advanced iPhone 13 motherboard maintenance and chip-level repair operations. Designed to provide consistent and controlled heating, this professional heating platform assists technicians in safely removing ICs, reworking solder joints, separating layered boards, and performing motherboard restoration procedures.

Built with intelligent temperature management technology, the SS-T12A-N13 ensures even heat distribution across the repair area, reducing thermal stress and minimizing the risk of board deformation. Its optimized heating surface is tailored for iPhone 13 series motherboards, making it an essential tool for repair centers and professional technicians.

Whether you’re performing CPU rework, NAND replacement, BGA repairs, or motherboard diagnostics, the SS-T12A-N13 delivers the stability and accuracy needed for high-success repair outcomes.

Key Features

  • Designed specifically for iPhone 13 series motherboard repair
  • Intelligent digital temperature control system
  • Uniform and stable heating performance
  • Supports chip removal and motherboard rework
  • Helps reduce PCB warping during repair
  • Fast heating with accurate temperature regulation
  • Ideal for layered motherboard separation
  • Durable and professional-grade construction
  • Compact design suitable for repair workstations
  • Improves repair efficiency and success rates

Technical Specifications

Specification Details
Product Name IP13 Motherboard Repair Heating System
Model SS-T12A-N13
Application iPhone 13 Motherboard Repair
Product Type PCB Heating Platform
Temperature Control Intelligent Digital Control
Heating Method Uniform Surface Heating
Compatible Devices iPhone 13 Series
Function Chip Removal, Soldering, Rework, Board Separation
Usage Environment Mobile Repair Workshop
Construction Heat-Resistant Professional Design
Weight 0.50 kg
Dimensions 12 × 4 × 2 cm