JTX 138C Low Temperature Solder Paste

JTX 138°C 50g Low Temperature Solder Paste for IC Reballing & PCB Repair

The JTX 138°C 50g Low Temperature Solder Paste is a professional-grade solution designed for precision soldering, IC reballing, and PCB repair applications. Engineered with a low melting point of 138°C, this solder paste minimizes heat exposure, making it ideal for sensitive electronic components such as BGA chips, CPUs, and mobile motherboards.

Its advanced formulation ensures excellent wetting performance, smooth flow, and strong adhesion, resulting in clean and durable solder joints. The paste spreads evenly during application and reflows efficiently, reducing issues like bridging, oxidation, and cold solder joints.

Designed for both manual and reflow soldering, the JTX 138C paste is widely used in mobile phone repair, micro-soldering, and electronics assembly. Its moderate viscosity and anti-oxidation properties ensure stable performance and consistent results even in complex repair tasks.

Packed in a convenient 50g container, it provides sufficient quantity for regular use, making it a cost-effective and reliable choice for professional technicians and repair labs.

Key Features

• Low melting point (138°C) for safe soldering
• Ideal for IC, BGA, CPU, and PCB repair
• Smooth flow and excellent wetting performance
• Strong adhesion for durable solder joints
• Reduces oxidation, bridging, and defects
• Moderate viscosity for precise application
• Suitable for manual and reflow soldering
• Anti-oxidation formula for consistent results
• 50g pack for long-lasting use
• Professional-grade performance

Technical Specifications