JTX SM02 iPhone 8 / 8 Plus / X Swap Board Chips BGA Reballing Platform
The JTX SM02 iPhone Swap Board Chips BGA Reballing Platform is a professional motherboard repair tool designed specifically for iPhone 8, iPhone 8 Plus, and iPhone X logic board repair and chip-level reballing. This advanced repair platform provides precise positioning and stable magnetic alignment, making it ideal for technicians performing CPU, NAND, and motherboard chip replacement or reballing.
Engineered with a super magnetic positioning base, the platform securely holds the motherboard and stencil during soldering, ensuring accurate chip alignment and efficient tin planting. The included precision stencil and blue positioning module help technicians achieve perfect solder ball formation and improve success rates during complex motherboard repairs.
Built using high-quality steel and heat-resistant materials, the JTX SM02 platform offers excellent durability, wear resistance, and stability during high-temperature BGA soldering operations. Its synthetic stone base and anti-slip rubber pads provide strong support, shock absorption, and safe operation on repair workstations.
With its modular design and professional-grade build, the JTX SM02 reballing platform is an essential tool for mobile repair technicians performing iPhone board swap, CPU reballing, and motherboard micro-soldering tasks.
Key Features
- Designed for iPhone 8, iPhone 8 Plus, and iPhone X motherboard repair
- Professional BGA reballing platform for chip swapping
- Super magnetic positioning base for precise alignment
- Includes blue positioning module and precision stencil
- Strong magnetic clamping for secure motherboard holding
- High-temperature resistant positioning plate
- Synthetic stone base for stability and durability
- Square chamfered mesh design for perfect solder ball formation
- Anti-slip rubber feet for stable workstation operation
- Ideal for CPU, NAND, and motherboard chip reballing
Technical Specifications
- Product Name: JTX SM02 Swap Board Chips Reballing Platform
- Brand: JTX
- Model: SM02
- Compatibility: iPhone 8 / 8 Plus / iPhone X
- Function: BGA chip reballing and motherboard swap repair
- Material: High-quality steel + synthetic stone base
- Base Type: Super magnetic positioning base
- Heat Resistance: High temperature resistant positioning plate
- Accessories Included: 1 Blue module + 1 stencil
- Application: Mobile motherboard repair / CPU & NAND reballing
| Weight | 0.100 kg |
|---|---|
| Dimensions | 20 × 18 × 15 cm |
