Amaoe Samsung E8835P Stencil

The Amaoe Samsung E8835P Stencil is a high-precision BGA reballing stencil designed for repairing Samsung motherboard chips and IC components. Manufactured with premium stainless steel mesh, this stencil provides accurate hole positioning and consistent solder ball formation, making it ideal for professional mobile repair technicians.

This stencil is specifically engineered for Samsung E8835P chip reballing, helping technicians perform precise solder ball placement during CPU, power IC, and motherboard chip repairs. Its ultra-thin design ensures proper heat transfer during soldering while preventing stencil deformation under high temperatures.

The Amaoe E8835P stencil offers excellent durability, corrosion resistance, and precise alignment, allowing technicians to achieve reliable and professional results during BGA rework and microsoldering tasks. Whether used in professional repair labs or mobile repair workshops, it is an essential tool for accurate chip reballing and motherboard restoration.

Key Features

• Designed for Samsung E8835P chip reballing
• High-precision BGA reballing stencil
• Made from premium stainless steel
• Accurate hole positioning for perfect solder ball placement
• Ultra-thin mesh for improved heat transfer
• High temperature resistance for soldering processes
• Durable and corrosion-resistant material
• Suitable for professional mobile motherboard repair
• Easy alignment for quick and efficient reballing
• Ideal for technicians performing chip-level repairs

Technical Specifications

• Product Name: Amaoe Samsung E8835P Stencil
• Brand: Amaoe
• Model: E8835P
• Type: BGA Reballing Stencil
• Material: High-quality stainless steel
• Design: Precision laser-cut mesh
• Heat Resistance: High temperature resistant
• Application: Samsung motherboard chip repair
• Function: Solder ball planting / BGA reballing
• Usage: Mobile phone motherboard repair