JTX SM10 iPhone 16 Reballing Platform

JTX SM10 iPhone 16 Series Swap Board Chips Reballing Platform

The JTX SM10 iPhone 16 Reballing Platform is a professional IP swap board chips BGA reballing platform designed specifically for iPhone 16, 16 Plus, 16 Pro, and 16 Pro Max motherboard repairs. This advanced repair tool provides precise alignment and secure positioning during chip reballing, IC replacement, and motherboard-level maintenance.

Built with high-quality heat-resistant materials, the platform ensures stability and accuracy while performing delicate microsoldering operations. The included blue module and precision stencils help technicians align chips perfectly, reducing soldering errors and improving the success rate of motherboard repairs.

Its durable construction and professional design make the JTX SM10 reballing platform an essential tool for mobile repair technicians working with modern iPhone logic boards. The stable base securely holds the motherboard during repair processes, enabling efficient and safe chip swaps, BGA reballing, and IC replacement.

Whether used in professional repair labs or mobile service centers, this platform improves workflow efficiency and ensures accurate chip placement during advanced board-level repairs.

Key Features

• Designed for iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max motherboard repair
• Professional IP swap board chips reballing platform
• Includes 1 blue positioning module and 2 precision stencils
• Stable platform for accurate chip alignment
• Heat-resistant material suitable for soldering work
• Ensures precise BGA reballing and chip replacement
• Durable construction for long-term professional use
• Reduces chip misalignment and soldering errors
• Suitable for advanced microsoldering and logic board repair
• Ideal for mobile repair technicians and repair labs

Technical Specifications

• Product Name: JTX SM10 Swap Board Chips Reballing Platform
• Model: SM10
• Brand: JTX
• Type: BGA Reballing Platform / Chip Swap Tool
• Compatibility: iPhone 16 / 16 Plus / 16 Pro / 16 Pro Max
• Included Modules: 1 Blue positioning module
• Included Stencils: 2 precision reballing stencils
• Material: Heat-resistant composite + steel stencil
• Function: Chip reballing, motherboard repair, IC swap
• Application: iPhone logic board microsoldering repair