JTX SM05 iPhone 12 / 12 Pro / 12 Pro Max Swap Board Chips Reballing Platform
The JTX SM05 iPhone 12 Reballing Platform is a professional IP swap board chips BGA reballing platform designed for precise motherboard repairs on iPhone 12, iPhone 12 Pro, and iPhone 12 Pro Max devices. This advanced repair tool helps technicians perform accurate chip reballing, IC replacement, and motherboard microsoldering with improved stability and alignment.
The platform includes 1 blue positioning module and 1 precision stencil, allowing technicians to securely fix the motherboard and align chips correctly during the soldering process. Its strong magnetic positioning system and heat-resistant construction ensure safe operation when working with hot air stations and soldering equipment.
Designed for professional mobile repair technicians, the JTX SM05 platform enhances repair efficiency by providing precise chip placement and minimizing the risk of soldering errors during complex motherboard-level repairs.
With its durable build and precision engineering, this reballing platform is an essential tool for iPhone motherboard repair labs, mobile service centers, and advanced microsoldering technicians.
Key Features
- Specially designed for iPhone 12 / 12 Pro / 12 Pro Max motherboard repair
- Professional IP swap board chips BGA reballing platform
- Includes 1 blue positioning module and 1 precision stencil
- Strong magnetic base ensures stable motherboard positioning
- High-temperature resistant material for safe soldering
- Precise chip alignment for accurate IC reballing
- Durable high-quality steel construction
- Anti-slip base with shock-absorbing rubber pads
- Prevents stencil bulging and improves solder ball formation
- Ideal for microsoldering and chip swap repairs
Technical Specifications
- Product Name: JTX SM05 Reballing Platform
- Model: SM05
- Brand: JTX
- Tool Type: BGA Reballing Platform / Chip Swap Tool
- Compatible Devices: iPhone 12 / 12 Pro / 12 Pro Max
- Included Modules: 1 Blue positioning module
- Included Stencil: 1 precision stencil
- Material: High-temperature resistant steel + composite base
- Base Type: Magnetic positioning platform
- Application: Chip reballing, motherboard repair, IC replacement
- Use Case: Professional mobile phone repair and microsoldering
| Weight | 0.100 kg |
|---|---|
| Dimensions | 20 × 18 × 15 cm |
