JTX SM04 iPhone 11 Reballing Platform

JTX SM04 iPhone 11 / 11 Pro / 11 Pro Max Swap Board Chips Reballing Platform (Blue Module + Stencil)

The JTX SM04 iPhone 11 Reballing Platform is a professional BGA chip reballing tool specially designed for repairing and swapping motherboard chips on iPhone 11, 11 Pro, and 11 Pro Max devices. This advanced repair platform includes a precision blue positioning module and stencil, enabling technicians to perform accurate chip reballing and motherboard repair with maximum stability.

Designed with high-precision alignment and strong magnetic positioning, the platform ensures perfect chip placement during soldering and reballing operations. Its heat-resistant structure and stainless-steel stencil allow technicians to work efficiently with hot air stations while maintaining precise solder ball formation.

The JTX SM04 reballing platform is widely used by professional mobile repair technicians for logic board repair, CPU chip reballing, and motherboard chip replacement, helping improve repair accuracy and reduce work time.

This tool is ideal for advanced GSM repair labs and technicians working on iPhone motherboard repair and chip-level servicing.

Key Features

• Designed specifically for iPhone 11 / 11 Pro / 11 Pro Max motherboard repair
• Includes 1 blue positioning module and 1 precision stencil
• Super magnetic positioning system for accurate chip alignment
• High-temperature resistant materials for safe reballing operations
• Precision laser-cut stencil holes for perfect solder ball formation
• Durable stainless steel construction for long-term professional use
• Helps technicians perform fast chip swapping and BGA reballing
• Strong magnetic clamping for stable motherboard positioning
• Improves repair accuracy and reduces soldering errors
• Ideal for professional mobile repair workshops

Technical Specifications