JTX SM07 iPhone 14 Reballing Platform
Rs.650.00
The JTX SM07 iPhone 14 / 14 Plus Reballing Platform is a professional motherboard repair tool designed for IP swap board chip transfer and BGA reballing. It includes a precision blue module and stencil for accurate chip alignment and stable micro-soldering during advanced iPhone logic board repairs.
Out of stock
JTX SM07 iPhone 14 / 14 Plus IP Swap Board Chips Reballing Platform (Blue Module + Stencil)
The JTX SM07 iPhone 14 / 14 Plus IP Swap Board Chips Reballing Platform is a precision repair tool designed for professional mobile technicians performing logic board repair, IP swap, and BGA chip reballing on iPhone 14 series devices.
This advanced reballing platform includes a durable blue positioning module and high-precision stencil, allowing technicians to accurately align chips and perform motherboard-level repairs with maximum stability. The platform ensures secure chip placement, improved solder ball accuracy, and reduced risk of alignment errors during delicate micro-soldering operations.
Built using heat-resistant materials and precision-machined positioning slots, the JTX SM07 platform helps maintain chip stability during reflow soldering and chip transfer processes. Its professional design makes it ideal for iPhone 14 and iPhone 14 Plus logic board IP swap repairs, improving efficiency and success rates in advanced motherboard repair work.
Whether you’re performing CPU/NAND chip transfers, BGA reballing, or motherboard refurbishment, the JTX SM07 platform provides reliable positioning, faster workflow, and consistent professional results.
High-precision reballing tools like these ensure accurate solder ball placement and stable chip positioning during micro-soldering and motherboard repairs.
Key Features
- Designed specifically for iPhone 14 & iPhone 14 Plus motherboard repairs
- Ideal for IP swap board chip transfer and BGA reballing
- Includes precision blue positioning module
- Comes with dedicated stencil for accurate solder ball placement
- High-precision alignment for CPU, NAND, and logic board chips
- Strong heat resistance for hot air and reflow soldering
- Stable platform structure prevents chip movement
- Reduces soldering errors during motherboard repairs
- Professional tool for advanced micro-soldering technicians
- Improves repair efficiency and success rate
Technical Specifications
| Specification | Details |
|---|---|
| Brand | JTX |
| Model | SM07 |
| Product Type | IP Swap Board Chip Reballing Platform |
| Compatible Devices | iPhone 14 / iPhone 14 Plus |
| Function | Chip Reballing / IP Swap Repair |
| Included Module | Blue Positioning Module |
| Included Tool | Precision Reballing Stencil |
| Material | Heat-resistant alloy & precision steel |
| Application | CPU / NAND / BGA chip reballing |
| Usage | Mobile motherboard repair & micro soldering |
| Condition | Brand New |
| Weight | 0.100 kg |
|---|---|
| Dimensions | 20 × 18 × 15 cm |
