JTX SM08 iPhone 14 Pro / 14 Pro Max / 15 / 15 Plus IP Swap Board Chips Reballing Platform – Blue Module + Stencil
The JTX SM08 iPhone Reballing Platform is a professional motherboard repair tool designed specifically for iPhone 14 Pro, 14 Pro Max, iPhone 15, and 15 Plus chip-level repairs. This precision platform allows technicians to perform IP swap, CPU reballing, and motherboard chip soldering with higher accuracy and stability.
Equipped with a high-temperature resistant blue positioning module and precision stencil, the SM08 platform ensures perfect chip alignment and reliable solder ball formation. Its strong magnetic base and precision positioning structure keep the motherboard firmly secured during reballing, reducing movement and improving repair efficiency.
Built from high-quality steel and heat-resistant materials, the platform withstands high soldering temperatures while maintaining durability and accuracy. The square chamfer mesh design ensures uniform solder ball formation and prevents tin bridging during chip reballing.
Ideal for professional microsoldering technicians and mobile repair shops, the JTX SM08 helps achieve faster, safer, and more precise motherboard chip repairs.
Key Features
- Designed for iPhone 14 Pro / 14 Pro Max / 15 / 15 Plus motherboard chip reballing
- Super magnetic base for firm motherboard positioning
- Blue heat-resistant module for precise chip alignment
- Precision stencil included for accurate solder ball placement
- Automatic alignment design improves repair efficiency
- High-temperature resistant materials suitable for hot air rework
- High-quality steel stencil for durability and repeated use
- Square chamfer hole design ensures round and uniform solder balls
- Anti-slip rubber foot pads for stable working conditions
- Perfect tool for IP swap, CPU IC reballing, and motherboard repair
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | JTX SM08 Reballing Platform |
| Compatible Models | iPhone 14 Pro / 14 Pro Max / iPhone 15 / 15 Plus |
| Application | IP Swap / CPU IC Reballing / Motherboard Repair |
| Module Type | Blue Positioning Module |
| Stencil Material | High-quality heat-resistant steel |
| Base Type | Super Magnetic Base |
| Heat Resistance | High-temperature resistant |
| Alignment System | Precision positioning structure |
| Design | Anti-slip rubber feet with stable base |
| Usage | Professional mobile repair technicians |
| Weight | 0.100 kg |
|---|---|
| Dimensions | 20 × 18 × 15 cm |
