LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone 11–17PM

LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Platform Set for iPhone 11–17PM

The LB Tool F20 Max Motherboard Middle Layer BGA Reballing Stencil Platform Set is a professional fixture system designed for precision middle-layer motherboard BGA reballing and IC repair on supported iPhone models from the iPhone 11 through 17 Pro Max series.

The platform is designed to help technicians securely position and stabilize compatible motherboard layers during BGA reballing, soldering, desoldering, and IC refurbishment. A stable fixture is particularly important when working with densely populated smartphone motherboards, where accurate alignment and consistent positioning can significantly affect repair results.

The F20 Max is suited to professional mobile phone motherboard repair, CPU/IC reballing, sandwich-board servicing, PCB repair, and component-level diagnostics. Its dedicated stencil-platform configuration provides a more organized and repeatable setup compared with improvised holding methods.

For repair technicians handling modern iPhone motherboard work, the LB Tool F20 Max offers a practical solution for maintaining board alignment throughout delicate BGA repair procedures.

Key Features

• Professional BGA reballing stencil platform set.
• Designed for motherboard middle-layer BGA repair.
• Supports compatible iPhone 11–17 Pro Max series models.
• Helps maintain stable motherboard positioning during reballing.
• Suitable for IC, CPU, and BGA component refurbishment.
• Useful for sandwich motherboard and middle-layer repair.
• Provides controlled positioning during soldering and desoldering.
• Helps improve repeatability during precision motherboard work.
• Suitable for professional mobile phone repair workshops.
• Practical fixture solution for advanced board-level technicians.

Technical Specifications