Luban A19 CPU BGA Reballing Stencil

Luban CPU Integrated BGA Reballing Stencil for iPhone 17 / Air Series Apple A19 / A19 Pro CPU

The Luban CPU Integrated BGA Reballing Stencil is a professional high-precision repair accessory specially engineered for Apple A19 and A19 Pro CPU chip reballing and motherboard repair on iPhone 17 and Air Series devices. Designed for advanced GSM technicians and chip-level repair professionals, this stencil provides accurate solder ball alignment and stable rework support for complex BGA repair procedures.

Manufactured using premium high-strength stainless steel, the Luban reballing stencil offers excellent heat resistance, precision accuracy, and long-term durability under high-temperature repair conditions. Its precision laser-cut mesh structure ensures uniform solder ball placement and accurate CPU alignment during reballing operations.

The integrated stencil design simplifies the BGA repair process by improving positioning stability and reducing alignment errors during chip maintenance. It is specifically optimized for Apple A19 and A19 Pro CPU architectures, helping technicians achieve cleaner soldering results and improved motherboard repair success rates.

Key Features:

• Designed for Apple A19 and A19 Pro CPU reballing
• Compatible with iPhone 17 and Air Series repair
• High-precision laser-cut BGA stencil structure
• Durable stainless steel heat-resistant construction
• Accurate solder ball alignment for stable rework
• Helps reduce solder bridging and misalignment
• Integrated design improves repair efficiency
• Suitable for advanced motherboard repair operations
• Reusable professional-grade chip repair accessory
• Ideal for GSM and chip-level repair technicians

Technical Specifications:

• Product Name: Luban CPU Integrated BGA Reballing Stencil
• Compatibility: Apple A19 / A19 Pro CPU
• Supported Devices: iPhone 17 / Air Series
• Material: High-strength stainless steel
• Function: CPU chip reballing and BGA repair
• Design: Precision laser-cut integrated stencil
• Application: Motherboard and chip-level repair
• Heat Resistance: High-temperature rework support
• Usage Type: Professional GSM repair equipment
• Operation: Reusable precision BGA repair tool