MaAnt A19 / A19 Pro Magnetic Dynamic Tin Planting Platform
The MaAnt A19 / A19 Pro Magnetic Dynamic Tin Planting Platform is an advanced solution designed for high-precision BGA reballing and CPU solder ball planting. Built with a powerful magnetic positioning system, it ensures stable alignment and accurate soldering for a wide range of chipsets, including Apple, Qualcomm, MTK, Samsung, and HiSilicon.
This upgraded platform supports universal BGA chip reballing, making it ideal for professional technicians handling complex motherboard repairs. Its high-temperature resistant construction prevents deformation, ensuring durability and long-term performance during intensive repair tasks.
With precise stencil alignment and magnetic adhesion, the MaAnt A19 series delivers efficient, consistent, and high-success-rate reballing, making it an essential tool for advanced mobile repair labs.
Key Features
- Magnetic dynamic positioning system for precision work
- Supports A19 / A19 Pro series CPU chipsets
- Universal compatibility with major chip brands
- High-temperature resistant – no deformation or bulging
- Strong magnetic adhesion for stable operation
- Accurate stencil alignment for perfect solder ball placement
- Suitable for Apple, Qualcomm, MTK, Samsung, HiSilicon CPUs
- Improves reballing efficiency and success rate
- Professional-grade CNC construction
- Ideal for advanced BGA and motherboard repair
Technical Specifications
- Brand: MaAnt
- Model: A19 / A19 Pro
- Type: Magnetic tin planting platform
- Function: BGA reballing, solder ball planting
- Material: High-temperature resistant alloy
- Positioning System: Magnetic dynamic alignment
- Compatibility:
- Apple A-series CPUs (A8–A19 Pro)
- Qualcomm Snapdragon series
- MediaTek (MTK) series
- Samsung Exynos series
- HiSilicon Kirin series
- Stencil Support: Multiple included CPU stencil plates
- Heat Resistance: High-temperature resistant, anti-deformation
- Application: Mobile motherboard and chip repair











