MaAnt EMMC-3 eMMC / eMCP / UFS / UMCP / LPDDR / NAND / PCIe Comprehensive BGA Reballing Stencil – Professional Universal Memory Chip Tin Planting Platform
The MaAnt EMMC-3 eMMC / eMCP / UFS / UMCP / LPDDR / NAND / PCIe Comprehensive BGA Reballing Stencil is a professional-grade universal chip-level repair solution engineered for BGA technicians, motherboard specialists, data recovery engineers, and advanced microsoldering professionals who require precision solder ball planting across multiple storage and memory IC formats. Martview lists the MaAnt EMMC-3 as a comprehensive BGA reballing stencil specifically designed for a broad range of memory and storage chip architectures including eMMC, eMCP, UFS, UMCP, LPDDR, NAND, and PCIe platforms.
Designed for high-precision repair workflows, the EMMC-3 supports fine-pitch solder reconstruction for common BGA package families used in smartphone storage, tablet memory systems, embedded electronics, and board-level chip replacement. Comparable EMMC-3 stencil platforms commonly feature 0.15mm precision steel mesh, broad BGA compatibility, and support for multiple chip sizes such as BGA153, BGA162, BGA169, BGA178, BGA186, BGA221, and BGA254, making them ideal for advanced chip refurbishment and data repair environments.
Key Features
- Comprehensive Universal Chip Support: Compatible with eMMC, eMCP, UFS, UMCP, LPDDR, NAND, and PCIe memory architectures
- Professional EMMC-3 Platform: Designed for advanced storage and memory IC reballing workflows
- 0.15mm Precision Aperture Design: Fine-pitch tin planting for accurate solder ball placement
- Wide BGA Package Compatibility: Supports common chip footprints including BGA153 / 162 / 169 / 178 / 186 / 221 / 254 class platforms
- High-Precision Steel Mesh Construction: Helps maintain consistent solder alignment
- Reusable Workshop-Grade Design: Durable for repeated chip repair operations
- Square Hole Precision Layout: Supports cleaner solder ball distribution and reduced bridging
- Advanced Memory Chip Repair Utility: Ideal for smartphone, tablet, embedded storage, and motherboard servicing
- Universal Data Recovery Support: Useful for chip-off repair and memory restoration labs
- Professional Microsoldering Essential: Suitable for repair centers handling storage IC refurbishment
Technical Specifications
- Brand: MaAnt
- Model: EMMC-3
- Product Type: Comprehensive BGA Reballing Stencil / Tin Planting Platform
- Supported Chip Types: eMMC / eMCP / UFS / UMCP / LPDDR / NAND / PCIe
- Stencil Thickness: Approx. 0.15mm precision class
- Material: Precision-grade steel sheet / alloy mesh
- Hole Type: Square precision apertures
- Primary Applications: Tin planting, solder ball placement, BGA chip reballing, motherboard repair, storage IC restoration
- Common BGA Formats: BGA153 / 162 / 169 / 178 / 186 / 221 / 254 (varies by chip family)
- Target Users: BGA technicians, data recovery specialists, GSM motherboard engineers
