Mechanic iBGA 14 4-in-1 Middle Layer Tin-Planting Platform

Rs.1,298.00

The Mechanic iBGA 14 4-in-1 Middle Layer Tin-Planting Platform is a professional BGA reballing fixture designed for iPhone 14, 14 Plus, 14 Pro, and 14 Pro Max.

Mechanic iBGA 14 4-in-1 Middle Layer Tin-Planting Platform for iPhone 14 / 14 Plus / 14 Pro / 14 Pro Max

The Mechanic iBGA 14 4-in-1 Middle Layer Tin-Planting Platform is a precision-engineered repair fixture developed specifically for professional technicians performing chip-level repairs on the iPhone 14 series. Designed to support four popular models in one compact platform, it simplifies middle-layer solder ball planting and improves the accuracy of BGA reballing operations.

Manufactured from high-quality CNC-machined metal, the platform provides excellent stability, heat resistance, and precise alignment during soldering. Its dedicated positioning structure securely holds the motherboard and IC assembly in place, minimizing movement and ensuring accurate solder ball placement throughout the repair process.

The 4-in-1 design supports iPhone 14, iPhone 14 Plus, iPhone 14 Pro, and iPhone 14 Pro Max, eliminating the need for multiple individual fixtures. This saves workspace while increasing repair efficiency for professional service centers.

Designed for compatibility with hot air rework stations, solder paste, BGA stencils, and precision reballing tools, the platform enables reliable middle-layer tin planting, IC replacement, and motherboard restoration. It is ideal for repairing CPU layers, stacked logic boards, and other complex BGA assemblies found in modern Apple devices.

Whether restoring damaged solder joints or performing advanced motherboard maintenance, the Mechanic iBGA 14 4-in-1 Platform delivers the precision and stability required for successful chip-level repairs.

Key Features

  • Professional 4-in-1 middle-layer tin-planting platform
  • Compatible with the complete iPhone 14 series
  • Precision positioning for accurate BGA reballing
  • CNC-machined high-strength metal construction
  • Stable motherboard holding system
  • Heat-resistant and durable design
  • Supports middle-layer solder ball planting
  • Suitable for IC replacement and motherboard repair
  • Compatible with hot air rework equipment
  • Designed for professional repair technicians

Technical Specifications

Specification Details
Product Name Mechanic iBGA 14 4-in-1 Middle Layer Tin-Planting Platform
Product Type BGA Reballing & Tin-Planting Platform
Compatible Models iPhone 14, 14 Plus, 14 Pro & 14 Pro Max
Design 4-in-1 Integrated Platform
Material CNC Precision Metal Alloy
Function Middle Layer Tin Planting & BGA Reballing
Application Motherboard & IC Chip Repair
Heat Resistance High Temperature Resistant
Compatibility BGA Rework Tools & Hot Air Stations
User Level Professional Electronics Repair Technicians
Weight 0.30 kg
Dimensions 10 × 8 × 5 cm