MECHANIC iBGA MAX 6-in-1 Planting Platform

MECHANIC iBGA MAX 6-in-1 Planting Platform

The MECHANIC iBGA MAX 6-in-1 Planting Platform is a high-precision repair fixture engineered for technicians performing professional BGA chip reballing and motherboard restoration. Designed with a versatile 6-in-1 configuration, this platform supports multiple chip layouts, reducing the need for separate fixtures while improving repair efficiency.

Manufactured from premium CNC-machined aluminum alloy, the iBGA MAX offers exceptional strength, heat resistance, and dimensional accuracy. Its precision positioning mechanism securely holds ICs and motherboards in place during solder ball planting, minimizing movement and ensuring consistent alignment throughout the repair process.

The platform is ideal for middle-layer tin planting, CPU reballing, NAND repair, PMIC replacement, UFS/eMMC servicing, and other BGA chip repairs commonly performed on modern smartphones and electronic devices. It works seamlessly with BGA stencils, solder paste, solder balls, hot air rework stations, and microscope-assisted repair setups.

Its compact and durable construction makes it suitable for continuous professional use in electronics repair laboratories and mobile phone service centers. By providing stable positioning and repeatable accuracy, the iBGA MAX helps technicians achieve cleaner solder joints and higher repair success rates.

Whether restoring damaged ICs or carrying out advanced motherboard maintenance, the MECHANIC iBGA MAX 6-in-1 Planting Platform is an essential tool for precise and efficient chip-level repairs.

Key Features

• Professional 6-in-1 BGA planting platform
• Precision IC positioning for accurate reballing
• CNC-machined aluminum alloy construction
• High-temperature resistant design
• Stable motherboard and chip holding system
• Supports middle-layer tin planting
• Compatible with BGA stencils and solder balls
• Reusable and durable for daily workshop use
• Ideal for smartphone motherboard repair
• Designed for professional chip-level technicians

Technical Specifications