MIJING 158C High Purity Tin Paste
Rs.550.00
The MIJING 158C High Purity Tin Paste is a premium low-temperature soldering paste specially formulated for mobile phone repair, PCB assembly, BGA rework, and precision electronics soldering.
MIJING 158C High Purity Tin Paste High Resistance Soldering Paste for Mobile Repair
The MIJING 158C High Purity Tin Paste is a professional-grade soldering paste developed for technicians performing precision chip-level repairs and electronic assembly. Designed with a 158°C low melting point, it minimizes thermal stress on delicate electronic components while delivering excellent solder flow and strong bonding performance.
Manufactured using high-purity solder alloy, this tin paste provides outstanding conductivity, smooth melting characteristics, and consistent solder joint formation. Its optimized flux formula offers excellent wetting performance, allowing solder to spread evenly across pads and component leads for accurate and reliable results.
The low-residue formulation helps keep PCBs clean after soldering, reducing post-repair cleaning time while improving repair quality. It is suitable for use with hot air rework stations, BGA rework systems, reflow equipment, and precision soldering tools.
Ideal for smartphone motherboards, tablets, laptops, gaming consoles, BGA ICs, SMD components, FPC connectors, and PCB repairs, the MIJING 158C Tin Paste provides dependable soldering performance for both professional technicians and electronics enthusiasts.
Whether replacing ICs, reballing chips, or assembling precision electronic circuits, this solder paste ensures smooth operation, excellent joint strength, and consistent repair results.
Key Features
- High-purity low-temperature tin paste
- 158°C low melting point
- Excellent solderability and wetting performance
- Strong and reliable solder joints
- Low-residue flux formulation
- Smooth solder flow for precision work
- Suitable for BGA and SMD soldering
- High electrical conductivity
- Compatible with hot air and reflow soldering
- Ideal for professional electronics repair
Technical Specifications
| Specification | Details |
|---|---|
| Product Name | MIJING 158C High Purity Tin Paste |
| Product Type | Low-Temperature Soldering Paste |
| Melting Point | 158°C |
| Alloy Type | High-Purity Tin Alloy |
| Flux Type | Low Residue |
| Applications | PCB Assembly, BGA Rework & Mobile Repair |
| Suitable Components | BGA, SMD, IC Chips & FPC Connectors |
| Compatibility | Hot Air Rework Station & Reflow Equipment |
| Electrical Conductivity | High |
| User Level | Professional Electronics Repair Technicians |
| Weight | 0.60 kg |
|---|---|
| Dimensions | 6 × 4 × 2 cm |
