Mechanic iSm3 Jump wire Specific Paste 138°C

The Mechanic iSm3 Jump Wire Specific Paste is a specialized low-temperature solder paste designed for precision jumper wire soldering and micro PCB repair. Engineered for professional technicians, this paste offers high activity, smooth tinning, and strong bonding, making it ideal for delicate repair tasks like fingerprint circuits, flying line repair, and IC pad restoration.

With a low melting point of around 138°C–158°C, the iSm3 paste minimizes heat damage to sensitive components, ensuring safe and efficient soldering. Its nano-level particle formulation allows excellent wetting and easy tin planting, producing clean, full, and reliable solder joints without gaps or bubbles.

The paste features moderate viscosity, making it easy to apply even on extremely small solder points. It is commonly used for jumper wire fixing, pad repair, and micro-soldering applications in mobile phone motherboards and advanced electronics.

Designed with precision in mind, the Mechanic iSm3 Paste is a must-have for technicians who require accurate, low-temperature, and high-performance soldering results.

Key Features

• Low temperature solder paste (138°C–158°C)
• Specially designed for jumper wire and micro repair work
• High activity formula for fast tinning
• Smooth flow with excellent wetting performance
• Produces full and clean solder joints
• Ideal for fingerprint repair and flying line soldering
• Moderate viscosity for precise application
• Minimizes heat damage to sensitive components
• Suitable for PCB, IC, and mobile motherboard repair
• Professional-grade performance

Technical Specifications