Mijing IPH-21 BGA Reballing Stencil for iPhone XS–16 Pro Max

Mijing IPH-21 BGA Reballing Stencil for iPhone XS–16 Pro Max

The Mijing IPH-21 BGA Reballing Stencil is a professional precision stencil designed for motherboard-level iPhone repair and BGA chip reballing. It is developed to assist technicians when reballing critical components such as Baseband, Hard Disk, WiFi, NFC, and Code Chip ICs on compatible iPhone models.

Covering iPhone XS through iPhone 16 Pro Max, the IPH-21 provides accurate positioning of solder balls during BGA reballing procedures. Its precision design helps technicians achieve consistent solder-ball placement, making it a useful accessory for IC repair, motherboard refurbishment, and micro-soldering work.

The stencil is suitable for professional mobile phone repair shops, motherboard technicians, IC repair specialists, and refurbishment centers looking for a dedicated solution for iPhone BGA reballing applications.

Key Features

• Professional BGA Reballing Stencil: Designed for precision IC reballing applications.
• Wide iPhone Compatibility: Supports compatible iPhone models from XS through 16 Pro Max.
• Multiple IC Applications: Suitable for Baseband, Hard Disk, WiFi, NFC, and Code Chip ICs.
• Precision Solder Ball Positioning: Helps maintain accurate and consistent solder-ball placement.
• Motherboard Repair Solution: Ideal for advanced iPhone logic board and IC-level repair.
• Micro-Soldering Compatible: Suitable for professional BGA rework and motherboard refurbishment.
• Technician-Friendly Design: Helps simplify the reballing preparation process.
• Reusable Repair Accessory: Designed for repeated professional repair applications.
• Professional Workshop Use: Suitable for repair shops, IC technicians, and refurbishment centers.

Technical Specifications

• Brand: Mijing
• Model: IPH-21
• Product Type: BGA Reballing Stencil
• Main Application: iPhone Motherboard / IC Reballing
• Compatible Devices: iPhone XS to iPhone 16 Pro Max
• Supported IC Types: Baseband, Hard Disk, WiFi, NFC & Code Chip
• Application: BGA Reballing, IC Repair, Motherboard Repair & Refurbishment
• Usage: Solder Ball Alignment & IC Reballing
• Suitable For: Mobile Phone Repair Technicians, IC Specialists & Repair Centers