Amaoe Stencil-MU4

The Amaoe Stencil-MU4 is a precision-engineered reballing stencil tailored for mobile phone repair and electronic board rework. Made from premium stainless steel, this high-accuracy stencil ensures optimal solder paste placement and uniform distribution during BGA reballing and IC chip alignment. Its clean laser-cut apertures help reduce bridging, enhance solder flow, and support consistent, reliable repair results — even on the smallest mobile motherboard components.

Compact, lightweight, and durable, the MU4 stencil is an essential addition to the toolkit of any professional technician or advanced DIY repairer looking to improve precision and workflow efficiency for challenging soldering tasks.

Key Features:

• Precision laser-cut design for accurate BGA and PCB reballing
• Premium stainless steel construction for durability
• Ensures uniform solder paste and ball placement
• Minimizes solder bridging and misalignment
• Compact and lightweight for easy handling
• Ideal for mobile phone motherboard rework
• Enhances repair accuracy and consistency
• Suitable for professional technicians and hobbyists
• Improves workflow speed and precision
• Designed for repeated workshop use

Technical Specifications:

• Brand: Amaoe
• Model: MU4
• Material: High-quality stainless steel
• Application: BGA/PCB reballing & IC solder paste alignment
• Finish: Corrosion-resistant metallic surface
• Reusable: Yes
• Weight: Approx. 0.1 kg