Relife RL-101B IC Glue Removing Tools

Relife RL-101B IC Glue Removing Tools

The Relife RL-101B IC Glue Removing Tools is a professional precision tool set specifically designed for removing underfill glue, black adhesive, and stubborn residues from IC chips and motherboard components during advanced electronics repair. Engineered for mobile phone technicians and micro soldering specialists, this tool enables safe and efficient adhesive removal without damaging delicate PCB traces or surrounding components.

Manufactured from high-quality alloy steel, the RL-101B offers exceptional durability, wear resistance, and precise control for intricate repair operations. Its ultra-thin working tips are designed to access tight spaces around integrated circuits, making it ideal for CPU repairs, NAND chip servicing, BGA rework, and motherboard restoration.

The ergonomic anti-slip handle ensures a comfortable grip and enhanced precision during prolonged use, helping technicians improve repair efficiency and reduce the risk of accidental damage. Whether you’re working on smartphone logic boards or advanced microelectronics, the Relife RL-101B IC Glue Removing Tools deliver the reliability and accuracy required for professional repair environments.

Key Features

• Professional IC glue removal tool for precision motherboard repairs.
• Effectively removes underfill glue and black adhesive residues.
• Ultra-thin tips provide access to tight working areas.
• Made from high-strength alloy steel for long-lasting durability.
• Anti-slip ergonomic handle offers excellent control.
• Minimizes the risk of PCB and component damage.
• Ideal for CPU, NAND, IC chip, and BGA rework applications.
• Lightweight and easy to operate.
• Designed for professional mobile repair technicians.
• Suitable for advanced micro soldering and electronics maintenance.

Technical Specifications