YCS 138 Solder Paste PPD 50G

Achieve safe and precise soldering on sensitive components with the YCS 138 Solder Paste PPD 50G, specially formulated for low-temperature BGA reballing, SMT soldering, and PCB repair. With an ultra-low melting point of 138°C, this solder paste is perfect for working on heat-sensitive ICs and delicate circuit boards, reducing the risk of thermal damage.

Engineered for excellent wettability and smooth application, the YCS 138 paste ensures uniform solder joints, strong electrical conductivity, and reliable performance. Its low-residue formulation minimizes cleaning efforts, allowing technicians to maintain a clean and efficient workflow.

Ideal for professional mobile repair technicians and advanced electronics work, the YCS 138 Solder Paste delivers precision, safety, and high-quality results in every repair job.

Key Features:

• Ultra-low melting point (138°C) for sensitive components
• Smooth flow for precise and controlled application
• Strong adhesion and reliable conductivity
• Ideal for BGA reballing and SMT soldering
• Minimizes thermal damage to ICs and PCBs
• Low residue formula for cleaner results
• Reduces solder bridging and defects
• Suitable for mobile phone and electronics repair
• Easy to apply and handle
• Consistent performance for professional use

Technical Specifications:

• Brand: YCS
• Product Name: 138 Solder Paste PPD
• Net Weight: 50 Gram
• Melting Point: 138°C
• Application: BGA reballing, SMT soldering, PCB repair
• Composition: Fine alloy solder particles
• Residue: Low residue / semi no-clean
• Compatibility: Mobile phones, IC chips, circuit boards
• Packaging: Jar/Container
• Reusability: Multiple applications
• Package Includes: 1 x YCS 138 Solder Paste PPD 50G