2UUL BH09 THE ONE JIG (Indian Version) for Mobile Phone Motherboard IC Repair

2UUL BH09 THE ONE JIG (Indian Version) for Mobile Phone Motherboard IC Repair

For technicians, mobile repair shops, and service centers needing precision and reliability, the 2UUL BH09 The One Jig delivers a stable, high-performance platform for motherboard and IC-level repair tasks. The fixture’s rotary-shaft locking clamp design grips motherboards or IC boards firmly — without rebound — ensuring the board stays immobile even during intensive hot-air rework, soldering, or back-glue removal.

A heat-dissipating base with integrated heat-sink allows hot-air to vent properly, protecting both the board and the components from heat-damage. The anti-slip pad under the base prevents shifting or sliding during repair, giving you a secure and safe workstation.

The jig offers adjustable-clamp distance (high / middle / low), so it can accommodate a wide range of PCB thicknesses and sizes — from slim smartphone logic boards to larger multi-layer boards with heavy chips. This versatility makes BH09 ideal for tasks like CPU/NAND replacement, BGA reballing, chip-level soldering, motherboard layout work, or general PCB rework.

Whether you are performing delicate micro-soldering under a microscope, reballing chips, or doing full-board rework, the 2UUL BH09 The One Jig provides stability, heat resistance, and precision necessary for professional-grade results.

⭐ Key Features

• 🔒 Rotary-shaft locking clamp — holds board or IC firmly without rebound, ideal for soldering or reballing.
• 🛠️ Adjustable clamp distance (high/mid/low) — accommodates PCBs and chips of various thicknesses and sizes.
• 🔥 Heat-sink equipped base clamp bottom — allows efficient hot-air dissipation and safer high-temperature operations.
• 🧱 Durable, heat-resistant metal-alloy build — suitable for repeated heavy-duty use in repair shops.
• 🧲 Anti-skid pad under base — prevents jig movement while you work, even under pressure or vibration.
• 🔧 Universal compatibility — works with various mobile phone motherboards, ICs, CPUs, NAND chips, and many types of PCB boards used in smartphones.
• 🧰 Stable support for BGA reballing, chip replacement, and glue removal — holds empty parts securely to avoid stress on IC beams.
• ⚙️ Protects double-layer motherboards — ensures both upper and bottom layers remain stable during repair.
• 📏 Compact bench-friendly size — ideal for small workbenches and easy storage.
• ✅ Professional-grade reliability — trusted by mobile repair engineers and service centers across India.
  

  ⚙️ Technical Specifications

  Specification	Detail
  Model	2UUL BH09 The One Jig (Indian Version)
  Use Case	Mobile phone motherboard repair, IC/CPU/NAND replacement, BGA/SMT reballing, PCB rework
  Material	High-temperature metal alloy (heat-resistant, anti-deformation)
  Clamp Mechanism	Rotary shaft locking clamp — fixed firmly without rebound
  Adjustable Clamp Levels	High / Middle / Low — adjustable via bottom screws and fixing plate
  Base Pad	Anti-skid pad for stable positioning on workstation
  Heat Resistance	Suitable for hot-air soldering / rework (supports heat dissipation via heat-sink clamp bottom)
  Compatibility	Smartphones: Android, Apple, multi-brand; PCBs of various sizes & shapes (single or double-layer)
  Weight	~0.50–0.55 kg (approximate as per listing)
  Package Contents	1 × 2UUL BH09 The One Jig fixture