Aixun Z12 BGA Reballing Stencil Mid-Layer Planting Tin Station for iPhone 12 / 12 Pro / 12 Pro Max / 12 Mini Motherboard
Rs.3,048.00
Aixun Z12 BGA Reballing Stencil Station is designed for iPhone 12 series motherboards, providing stable mid-layer positioning for tin planting, BGA reballing, CPU, IC, and component-level repair.
Aixun Z12 BGA Reballing Stencil Mid-Layer Planting Tin Station for iPhone 12 / 12 Pro / 12 Pro Max / 12 Mini Motherboard
The Aixun Z12 BGA Reballing Stencil Mid-Layer Planting Tin Station is a precision motherboard repair fixture designed specifically for iPhone 12 series layered motherboard repair and BGA reballing applications. It provides stable positioning and accurate alignment during tin planting, solder-ball placement, and component-level board repair.
Designed for iPhone 12, 12 Pro, 12 Pro Max, and 12 Mini motherboards, the Z12 helps technicians maintain proper alignment between the motherboard and BGA stencil during reballing work. Its dedicated structure makes it easier to perform precise mid-layer repair procedures while minimizing unwanted movement.
The Aixun Z12 is ideal for professional technicians handling CPU, IC, BGA, motherboard separation, mid-layer repair, and solder-ball rework, making it a useful addition to an advanced mobile phone motherboard repair workstation.
Key Features
- Dedicated iPhone 12 Series Design – Designed for iPhone 12, 12 Pro, 12 Pro Max, and 12 Mini motherboards.
- BGA Reballing Support – Helps technicians perform accurate solder-ball placement and BGA rework.
- Mid-Layer Planting Tin Station – Designed for layered motherboard tin planting applications.
- Precision Stencil Positioning – Helps maintain accurate alignment between the board and stencil.
- Stable Motherboard Holding – Reduces board movement during delicate reballing operations.
- CPU & IC Repair Support – Suitable for BGA-mounted CPU and IC repair workflows.
- Layered Motherboard Repair – Useful for iPhone 12 series middle-layer board servicing.
- Professional Repair Fixture – Designed for experienced mobile motherboard technicians.
- Improved Repair Efficiency – Helps streamline repetitive tin planting and reballing procedures.
- Reusable Workshop Tool – Suitable for repeated iPhone motherboard repair applications.
Technical Specifications
| Specification | Details |
|---|---|
| Brand | Aixun |
| Model | Z12 |
| Product Type | BGA Reballing Stencil & Mid-Layer Tin Planting Station |
| Compatible Models | iPhone 12 / 12 Pro / 12 Pro Max / 12 Mini |
| Application | Motherboard Repair & BGA Reballing |
| Primary Function | Mid-Layer Planting Tin & Stencil Positioning |
| Board Type | iPhone Layered Motherboard |
| Suitable For | CPU, IC & BGA Component Repair |
| Usage | Tin Planting, Reballing & Board-Level Repair |
| Professional Application | Mobile Phone Repair Workshops |
| Weight | 0.45 kg |
|---|---|
| Dimensions | 12 × 10 × 5 cm |
