Amaoe A17 RAM Stencil for iPhone 15 RAM Reballing

Rs.238.00

The Amaoe A17 RAM Stencil for iPhone 15 is a precision stainless steel stencil designed for accurate A17 RAM IC reballing, ideal for professional mobile repair technicians.

Amaoe A17 RAM Stencil for iPhone 15 RAM Reballing

The Amaoe A17 RAM Stencil for iPhone 15 is a precision-engineered reballing tool designed for accurate RAM IC reballing and repair on iPhone 15 series motherboards. Built for professional mobile technicians, this stencil ensures precise solder ball placement, making complex A17 RAM chip repairs faster and more reliable.

Manufactured using high-grade stainless steel with advanced laser cutting technology, the Amaoe A17 stencil offers exceptional durability and perfect alignment for micro-level soldering work. The ultra-thin design helps distribute heat evenly during the reballing process, reducing the risk of solder bridging and ensuring stable IC connections.

Specifically designed for A17 RAM chip layout, this stencil provides highly accurate hole patterns that match the chip perfectly. It allows technicians to perform professional-level BGA reballing with improved efficiency and precision.

Whether you operate a professional mobile repair lab or GSM service center, the Amaoe A17 RAM stencil is an essential tool for performing high-precision iPhone 15 motherboard repairs.


Key Features

  • Designed specifically for iPhone 15 A17 RAM chip reballing
  • Precision laser-cut hole pattern for accurate solder ball placement
  • Made from premium stainless steel
  • Ultra-thin design for better heat transfer
  • Ensures perfect IC alignment
  • Ideal for advanced micro soldering
  • Durable and long-lasting professional tool
  • Reduces solder bridging during reballing
  • Suitable for professional GSM repair technicians
  • Improves repair efficiency and accuracy

Technical Specifications

Specification Details
Product Name Amaoe A17 RAM Stencil
Brand Amaoe
Model A17
Compatible Device iPhone 15 Series
Application RAM IC Reballing
Material High-Quality Stainless Steel
Manufacturing Precision Laser Cutting
Design Ultra-Thin Stencil
Usage BGA RAM Chip Reballing
Category Mobile Phone Repair Tool

 

Weight 0.020 kg
Dimensions 15 × 12 × 10 cm