Amaoe BGA315 4in1 Stencil

The Amaoe BGA315 4in1 Stencil is a professional-grade reballing stencil designed for precise BGA315 NAND chip reballing and repair. This high-precision stencil is widely used by mobile phone technicians and repair professionals for NAND flash IC rework, ensuring accurate solder ball placement and stable chip connections.

Manufactured using premium stainless steel and advanced laser cutting technology, the stencil delivers perfect alignment and uniform hole patterns. Its ultra-thin and heat-resistant design allows technicians to perform reballing with greater efficiency while reducing solder bridging or misalignment issues.

The 4-in-1 design makes this stencil highly versatile, supporting multiple BGA315 NAND chip layouts commonly found in modern smartphones and tablets. This allows repair technicians to handle multiple repair scenarios with a single compact tool.

Whether you operate a mobile repair shop, micro-soldering workstation, or professional GSM service center, the Amaoe BGA315 4in1 Stencil is an essential tool for performing high-precision NAND IC reballing and motherboard repair.

Key Features

• Designed for BGA315 NAND flash IC reballing
• 4-in-1 stencil design supporting multiple chip layouts
• High-precision laser-cut hole pattern
• Made from premium stainless steel
• Ultra-thin structure for efficient heat transfer
• Ensures accurate solder ball alignment
• Reduces solder bridging and repair errors
• Durable and long-lasting professional tool
• Ideal for micro-soldering and motherboard repair
• Perfect for mobile phone repair technicians

Technical Specifications