Amaoe A17 CPU Stencil for iPhone 15

Rs.238.00

The Amaoe A17 CPU Stencil for iPhone 15 is a high-precision stainless steel stencil designed for accurate A17 CPU reballing, ideal for professional motherboard repair technicians.

Amaoe A17 CPU Stencil for iPhone 15

The Amaoe A17 CPU Stencil for iPhone 15 is a precision-engineered reballing stencil designed specifically for repairing and reballing the A17 CPU chip used in the iPhone 15 series. This professional repair tool enables technicians to accurately rebuild solder balls on the CPU, ensuring reliable connections and restoring motherboard functionality.

Manufactured with high-quality stainless steel and advanced laser cutting technology, the stencil offers perfect hole alignment and consistent spacing for precise solder ball placement. Its ultra-thin and heat-resistant structure allows efficient heat transfer during reballing, improving repair accuracy while reducing the risk of solder bridging.

This stencil is an essential tool for advanced micro-soldering and motherboard-level repairs, making it ideal for professional mobile repair technicians and GSM service centers. With its durable construction and precise design, the Amaoe A17 CPU stencil helps streamline CPU repair tasks while maintaining professional repair standards.


Key Features

  • Specially designed for iPhone 15 A17 CPU reballing
  • High precision laser-cut stencil holes
  • Made from premium stainless steel
  • Ensures accurate solder ball alignment
  • Ultra-thin design for better heat conduction
  • Reduces solder bridging and repair errors
  • Durable and reusable professional tool
  • Ideal for advanced CPU and motherboard repair
  • Compatible with professional micro-soldering stations
  • Perfect for mobile phone repair technicians

Technical Specifications

Specification Details
Product Name Amaoe A17 CPU Stencil
Brand Amaoe
Compatibility iPhone 15 Series
Chip Type A17 CPU
Material High-Quality Stainless Steel
Manufacturing Precision Laser Cutting
Thickness Ultra Thin
Application CPU Reballing
Usage Mobile Motherboard Repair
Tool Type IC Reballing Stencil

 

Weight 0.020 kg
Dimensions 15 × 12 × 10 cm