Amaoe BGA316 Stencil

The Amaoe BGA316 Stencil is a high-precision reballing stencil designed for professional BGA chip repair and solder ball rework. It is widely used by mobile phone technicians for accurate reballing of BGA316 chips found in various smartphone motherboards and electronic devices.

Crafted from premium stainless steel with precision laser cutting, this stencil ensures perfect hole alignment and consistent solder ball placement. The ultra-thin design allows excellent heat transfer during the reballing process, helping technicians achieve stable solder joints and reliable chip performance.

The Amaoe BGA316 stencil is built for durability and repeated use in professional repair environments. Whether you are performing IC reballing, motherboard repair, or advanced micro-soldering work, this stencil provides the precision and reliability required for successful repairs.

Key Features

• Designed specifically for BGA316 chip reballing
• High precision laser-cut holes for accurate solder placement
• Made from durable stainless steel material
• Ultra-thin design for efficient heat transfer
• Ensures perfect alignment of solder balls
• Helps reduce solder bridging during repairs
• Strong, reusable and long-lasting construction
• Ideal for mobile phone motherboard repair
• Suitable for professional micro soldering technicians
• Compatible with most BGA reballing processes

Technical Specifications