Amaoe AU-3 Stencil for iPhone CPU

The Amaoe AU-3 Stencil for iPhone CPU is a high-precision BGA reballing stencil specially designed for iPhone CPU chip repair and rework. Manufactured using premium-grade stainless steel and advanced laser-cut technology, this stencil ensures accurate solder ball placement and perfect alignment during CPU reballing procedures.

Ideal for professional mobile repair technicians, the AU-3 stencil helps reduce solder bridging, enhances solder joint reliability, and improves overall repair success rates. Its heat-resistant and corrosion-proof construction allows repeated use under hot air stations and reflow machines without deformation.

Whether you are performing CPU replacement, baseband repair, or advanced board-level servicing, the Amaoe AU-3 stencil delivers consistent, clean, and professional-grade results, making it an essential tool for any serious repair workshop.

Key Features:

• Specially designed for iPhone CPU BGA reballing
• Precision laser-cut stainless steel construction
• Ensures uniform and accurate solder ball alignment
• Reduces solder bridging and short circuit risks
• High heat resistance for hot air and reflow use
• Durable, anti-rust, and reusable design
• Improves solder joint strength and connectivity
• Lightweight and easy to position on PCB
• Suitable for advanced board-level repairs
• Ideal for professional mobile repair technicians

Technical Specifications:

• Brand: Amaoe
• Model: AU-3
• Material: Premium stainless steel
• Application: iPhone CPU BGA reballing
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: iPhone motherboard CPU IC chips