Amaoe BCM-1 Stencil

The Amaoe BCM-1 Stencil is a precision-engineered BGA reballing stencil developed for advanced IC chip repair and motherboard rework applications. Manufactured using premium stainless steel and high-accuracy laser cutting technology, this stencil ensures uniform solder ball placement and perfect alignment during reballing procedures.

Built for professional mobile repair technicians and PCB specialists, the BCM-1 stencil helps reduce solder bridging, enhance solder joint durability, and improve overall repair success rates. Its heat-resistant and corrosion-proof construction allows repeated use with hot air rework stations and reflow soldering systems without deformation.

Whether you are replacing BGA chips, servicing motherboard circuits, or performing detailed IC rework, the Amaoe BCM-1 stencil delivers clean, consistent, and professional-grade results every time.

Key Features:

• Precision laser-cut stainless steel construction
• Designed for accurate BGA IC reballing
• Ensures uniform solder ball alignment
• Minimizes solder bridging and short circuits
• High heat resistance for hot air and reflow use
• Durable, anti-rust, and reusable design
• Improves solder joint strength and conductivity
• Lightweight and easy PCB positioning
• Suitable for advanced motherboard repair
• Ideal for professional repair workshops

Technical Specifications:

• Brand: Amaoe
• Model: BCM-1
• Material: Premium stainless steel
• Application: BGA IC reballing and motherboard repair
• Thickness: Approx. 0.12 mm – 0.15 mm
• Precision Tolerance: ±0.01 mm
• Surface Finish: Anti-corrosion metallic coating
• Reusable: Yes
• Weight: Approx. 10–20 g
• Compatibility: Various BGA IC chip layouts (model-specific design)